System Solution Engineer - Optical Interconnect ICs for Datacom (d/m/f)

ppWe are LSP - Light Sensors Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing - combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems -driving performance, scalability, and innovation in high-growth segments. /p pJoin us in Premstätten, Regensburg, Pavia or Eindhoven and help define the future of optical connectivity for AI and data centers: /p ul liServe as a trusted technical advisor and build close relationships with key customers through regular on-site visits, providing technical leadership, gathering insights and identifying opportunities for future innovation /li liTranslate customer architectures and application requirements into differentiated Integrated Circuit (IC) product concepts and roadmaps /li liAct as the technical voice of the customer across Product Management, RD and Marketing /li liEngage directly with hyperscalers, networking companies, optical module suppliers and ecosystem partners /li liDrive the CMOS system architecture definition in the context of optics, photonics, mixed-signal ICs and packaging /li liAnalyze market trends, competing technologies and emerging optical interconnect architectures /li liIdentify CMOS IC technology gaps and recommend strategic investments for future product differentiation /li liSupport technical design-ins, customer evaluations and design-win activities worldwide /li liDevelop application notes, white papers, technical presentations and customer enablement materials /li liRepresent ams OSRAM at customer workshops, technical conferences and industry events /li /ul br/ ul liMaster's degree or PhD in Electrical Engineering, Microelectronics, Photonics or Physics /li liProven experience with mixed-signal CMOS, photodiodes, analog front-ends, drivers, TIAs or SerDes /li liExtensive industry experience in datacom, networking or optical interconnects /li liSolid understanding of datacenter (optical) links, transceivers and architectures /li liStrong system-level thinking across optics, electronics, packaging and integration /li liExperience working directly with customers on complex technical challenges and willingness to travel globally (approximately 50%) to engage with customers on-site /li liAbility to translate market needs into differentiated semiconductor solutions /li liExcellent English communication skills; German is a plus /li /ul pFor Austria: We offer competitive salaries and additional benefits based on your performance, experience and qualification. /p pThe employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H ( offer a higher compensation depending on your expertise and skills. /p /p #J-18808-Ljbffr