Programme Director

pA fast-growing deep-tech scale-up building a new AI compute platform from the ground up. Its proprietary processor architecture brings together custom silicon, stacked memory, advanced packaging, boards, firmware, system software and complete datacentre systems. This is a rare chance to lead delivery of next-generation AI hardware while the organisation, and the way it works, is still being shaped. /ppThis is not a PMO or reporting role. You'll be a hands-on semiconductor program leader who takes ownership of the integrated delivery of an AI compute platform, from product definition and architecture through tape-out, bring-up, package and system integration, software enablement, qualification and launch readiness. /ph3What you'll own /h3ulliOne integrated program baseline: scope, schedule, cost, resources, risks, decisions and external dependencies /liliThe silicon and tape-out critical path: RTL and verification readiness, design freeze, timing and power closure, sign-off evidence, mask release and foundry commitments /liliSystem-in-Package (SiP) and advanced packaging delivery, integrated with silicon, boards, firmware and software /liliCoordination of external partners, including physical design, foundry, memory, OSAT, packaging, test and IP vendors, holding owners to account at every interface /liliEvidence-based readiness reviews with clear exit criteria, not status reporting /liliEarly identification of critical dependencies and recovery planning when things move off baseline /liliClear trade-offs and decisions for executive review, covering roadmap, investment, capacity and risk /liliBuilding lean, practical Program Delivery ways of working as the business scales, and coaching program managers /li /ulh3What you'll bring /h3ulliPersonal ownership of at least one successful silicon tape-out, ideally through bring-up, qualification and productisation /liliHands-on experience of SiP / advanced packaging programs /liliA background in complex ASIC, AI accelerator, HPC, datacentre or similar deep-tech hardware programs /liliStrong understanding of semiconductor dependencies: architecture, RTL, verification, physical design, IP, PDKs, foundry, packaging and test /liliExperience managing external engineering, manufacturing and supply-chain partners /liliStrong program controls: integrated planning, dependency and risk management, change control and gate reviews /liliThe confidence to influence without hierarchy and challenge plans constructively /liliComfort with ambiguity, limited process and fast-changing priorities in a scale-up /liliA technical or engineering degree, or equivalent depth from industry experience /li /ulh3Working pattern and benefits /h3ulliFull-time and on-site in the Netherlands. Relocation to the Netherlands is required. /lili30 days' holiday plus Dutch holiday allowance /liliAn attractive employee share option scheme (ESOP) /liliImmediate or near-term start preferred /li /ul #J-18808-Ljbffr